“Effects of Film Stress Modulation Using TiN Metal Gate on Stress Engineering and Its Impact on Device Characteristics in Metal Gate/High-k Dielectric SOI FinFETs,”
C.Y. Kang, J.W. Yang, J.W. Oh, R. Choi, Y.J. Suh, H.C. Floresca, J. Kim, Mo.J. Kim, B.H. Lee, H-H. Tseng and R. Jammy
IEEE Electron Dev. Lett. 29, 487-490 (2008).

“Dopant Effects on the Thermal Stability of FUSI NiSi,”
P. Zhao, M.J. Kim, B.E. Gnade and R.M. Wallace,
Microelectronic Engineering, 85, 54-60 (2008).

“Highly Reproducible Single Polyaniline Nanowire using Electrophoresis Method,”
I. Lee, H.I. Park, S.Y. Park, M.J. Kim and M. Yun,
NANO: Brief Rep. Rev. 3, 75-82 (2008). ?cover page!

“Conformal Al2O3 Dielectric Layer Deposited by Atomic Layer Deposition for Graphene-based Nanoelectronics,”
B.K. Lee, S.Y. Park, H.C. Kim, K.J. Cho, E.M. Vogel, M.J. Kim, R.M. Wallace and J. Kim,
Appl. Phy. Lett. 92, 203102 (2008).

“Microstructure and Superconductivity of Zn and Au-Sn Junction Nanowires,”
J.G. Wang, M. Tian and M.J. Kim,
J. Nanosci. Nanotech. 8, 1-5 (2008).

“New FIB Fold-out Method for TEM Cross-section Sample Preparation,”
H.C. Floresca, J.B. Jeon and M.J. Kim,
Microsc. Microanal14(Suppl. 2), 1006-1007 (2008).

“CNT-FET Schottky Barrier Devices Fabricated by E-Beam Lithography,”
D. Perello, M.J. Kim, S.Y. Jeong, B.R. Kang, D.J. Bae, Y.H. Lee and M. Yun,
Microsc. Microanal 14(Suppl. 2), 410-411 (2008).

“P-N Junction Observation in a Single Transistor Device by in-situ TEM Electrical Measurement,”
S.Y. Park, D.K. Cha, O. Lourie and M.J. Kim,
Microsc. Microanal14(Suppl. 2), 402-403 (2008).

“Characterization of Nanodevices by using in-situ TEM-STM,”
J. Kim, D.K. Cha, S.Y. Park and M.J. Kim,
Microsc. Microanal14(Suppl. 2), 20-21 (2008).

“TEM Observation of Crack- and Pit-shaped Defects in Electrically Degraded GaN HEMTs,”
U. Chowdhury, J.L. Jimenez, C. Lee, E. Beam, P. Saunier, T. Balkstreri, S.Y. Park, T.H. Lee, J. Wang and M.J. Kim, J. Joh and J.A. del Alamo,
IEEE Electron Device Lett29, 1098-1100 (2008).

“Facile Synthesis of Bimetallic Nanoplates Consisting of Pd Cores and Pt Shells through Seeded Epitaxial Growth,”
B. Lim, J. Wang, P. Camargo, M. Jiang, M.J. Kim and Y. Xia,
Nano Letters Vol. 8 2535-2540 (2008).

“Shallow Trench Isolation Liners and Their Role in Reducing Lattice Strains,”
H.C. Floresca, J.G. Wang, M.J. Kim and J.A. Smythe,
Appl. Phys. Lett. 93, 143116 (2008).

“Relevance of Thermal Mismatch in Large-Area Composite Substrates of HgCdTe Heteroepitaxy,”
R.N. Jacobs, L.A. Almeida, J. Markunas, J. Pellegrino, M. Groenert, M. Jaime-Vasquez, N. Mahadik, C. Andrews, S.B. Qadri, T. Lee and M.J. Kim,
J. Electronic Mater. 37, 1480-1487 (2008).

“Origin of Tensile Stress in the Si Substrate Induced by TiN/HfO2 Metal Gate/High-k Dielectric Gate Stack,”
J.G. Wang, J. Kim, C.Y. Kang, B.H. Lee, R. Jammy, R. Choi and M.J. Kim,
Appl. Phys. Lett. 93, 161913 (2008).

“Thermal Stability of Nitrogen in Nitrided HfSiO2/SiO2/Si(001) Ultrathin Films,”
A. Herrera-Gomez, F.S. Aguirre-Tostado, M.A. Quevedo-Lopez, P.D. Kirsch, M.J. Kim and R.M. Wallace,
J. Appl. Phys. 104, 103520 (2008).

“Comparative Study of Thermal Mismatch Effects in CdTe/Si, CdTe/Ge and CdTe/GaAs Composite Structures,”
R.N. Jacobs, L.A. Almeida, J. Makunas, J. Pellegrino, M. Groenert, M. Jaime-Vasquez, N. Mahadik, C. Andrews, S.B. Qadri, T.H. Lee and M.J. Kim,
CS MANTECH Conference, Chicago, IL,17.7 (2008).

“Physical Degradation of GaN HEMT Device Observed in TEM during Reliability Test,”
S.Y. Park, C. Floresca, M.J. Kim, U. Chowdhury, J.L. Jimenes, C. Lee, E. Beam, P. Saunier and T. Balistreri,
2008 JEDEC ROCS Workshop Proceeding, Monterey, CA, 45-54 (2008).

“Fabrication Process for Double Barrier Si-Based Quantum Well Resonant Tunneling Diodes (RTD) by UHV Wafer Bonding,”
T.H. Lee, H.C. Floresca, S.J. Kang, J.J. Shim, K.H. Song, H.B. Kang, B.Y. Lee, R.M. Wallace, B.E. Gnade and M.J. Kim,
ECS Trans. 16(8), 525-530 (2008).

“Growth and Characterization of Alternative Gate Dielectrics by Molecular-Beam Epitaxy,”
L F. Edge, W. Tian, V. Vaithyanathan, T. Heeg, D.G. Schlom, D.O. Klenov, S. Stemmer, J.G. Wang, and M.J. Kim,
ECS Trans. 16(5), 213-227 (2008).

“Nano-Manipulation and Characterization for Graphene Sheet,”
S.Y. Park and M.J. Kim,
Korean Journal of Microscopy, 38(4) Suppl. 381-382 (2008)