“Controlled Planar Interface Synthesis by UHV Diffusion Bonding/Deposition,”
M.J. Kim, R.W. Carpenter, M. Cox and J. Xu,
J. Mater. Res. 15, 1008 (2000).

“A TEM Study of Cr-based Contacts to (0001) 6H-SiC,”
R.-J. Liu, M.J. Kim, R.W. Carpenter, L.M. Porter, L.P. Scheunemann and R.F. Davis,
Microsc. Microanal. 6 (Suppl. 2), 1064 (2000).

“Silicon Wafer Bonding: Effect of Wafer Surface Treatment on Interface Structure and Chemistry,”
M.J. Cox, M.J. Kim, H. Xu and R.W. Carpenter,
Microsc. Microanal. 6 (Suppl. 2), 1074 (2000).

“Si/SiC UHV Direct Wafer Bonded Interface Structure,”
M.J. Kim, H. Xu, R.-J. Liu and R.W. Carpenter,
Mat. Res. Soc. Symp. 587(C), O4.2.1 (2000).